DocumentCode
1733557
Title
Dielectric properties of epoxy composite materials with interpenetrating polymer networks
Author
Kim, Kyung-Hwan ; Kim, Myung-Ho ; Son, In-Hwan ; Kim, Jae-Hwan
Author_Institution
Dept. of Electr. Eng, Kyungwon Univ., Kyunggi, South Korea
Volume
1
fYear
1998
Firstpage
161
Abstract
In this paper, the influence of interpenetrating polymer network (IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO2 composite materials, were investigated. We reported a relation between network structure and electrical properties, especially dielectric properties with variation of network structures for epoxy composite materials. According to experimental results, the samples, which have single network structures, have lower dielectric constant than IPN samples, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that introducing of IPN insulating materials attains change of structures. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties
Keywords
composite insulating materials; epoxy insulation; filled polymers; permittivity; polymer blends; SiO2; defects; dielectric constant; dielectric properties; epoxy composite material; heat proof properties; insulating material; internal structure; interpenetrating polymer network; Composite materials; Curing; Dielectric constant; Dielectrics and electrical insulation; Educational institutions; Electromagnetic wave absorption; Epoxy resins; Moon; Polymers; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
Conference_Location
Arlington, VA
ISSN
1089-084X
Print_ISBN
0-7803-4927-X
Type
conf
DOI
10.1109/ELINSL.1998.704687
Filename
704687
Link To Document