DocumentCode
1735605
Title
High-power SiGe heterojunction bipolar transistor (HBT) with multiple emitter fingers
Author
Pei, Shen ; Wanrong, Zhang ; Dongyue, Jin ; Hongyun, Xie ; Jia, Li ; Junning, Gan
Author_Institution
Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing
fYear
2008
Firstpage
107
Lastpage
110
Abstract
High-power SiGe HBTs with multiple emitter fingers are developed by using interdigitated structure and each emitter stripe area of 3times45 mum2. The value of collector-emitter voltage Vce is carefully selected to ensure these power devices operating at high power levels. Four-Watt RF power with maximum high power-added efficiency (PAE) of 49% and power gain(Gp) of 6.71dB is achieved when SiGe HBTs operate at frequency of 900 MHz and Vce of 12V. The devices have emitter power linear density achieved as high as 1.47W/mm and the RF power density is 1.6W/mum2. The power performance of these devices under different bias conditions are also studied. These results set a benchmark for high power performance of the devices and show the great potential of SiGe HBTs for RF high-power amplifications.
Keywords
Ge-Si alloys; heterojunction bipolar transistors; power bipolar transistors; semiconductor materials; HBT; RF high-power amplification; SiGe; collector-emitter voltage; emitter power linear density; frequency 900 MHz; high-power heterojunction bipolar transistor; interdigitated structure; multiple emitter fingers; voltage 12 V; Chemical vapor deposition; Fabrication; Fingers; Gallium arsenide; Germanium silicon alloys; Heterojunction bipolar transistors; Plasma temperature; Radio frequency; Silicon germanium; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2008. IWJT '08. Extended Abstracts - 2008 8th International workshop on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1737-7
Electronic_ISBN
978-1-4244-1738-4
Type
conf
DOI
10.1109/IWJT.2008.4540028
Filename
4540028
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