DocumentCode

1735815

Title

Electromigration

Author

Sullivan, Timothy

Author_Institution

IBM Microelectronics

fYear

1999

fDate

6/21/1905 12:00:00 AM

Firstpage

136

Lastpage

137

Keywords

Electromigration; Guidelines; Life estimation; Manufacturing; NIST; Qualifications; Rivers; Stress; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 1999. IEEE International

Print_ISBN

0-7803-5649-7

Type

conf

DOI

10.1109/IRWS.1999.830576

Filename

830576