• DocumentCode
    173816
  • Title

    Linking aging measurements of health-monitors and specifications for multi-processor SoCs

  • Author

    Kerkhoff, Hans G. ; Jinbo Wan ; Yong Zhao

  • Author_Institution
    Testable Design & Test of Integrated Syst. (TDT Group), Univ. of Twente, Enschede, Netherlands
  • fYear
    2014
  • fDate
    6-8 May 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A new generation of highly dependable multi-processor Systems-on-Chip for safety-critical applications under harsh environments with zero down-time is emerging. In this paper1, the approach towards reaching this ultimate goal is explained. Crucial is this method is linking the measurement data of so-called (on-chip) health monitors during life time with the measurements of degrading key performance parameters of the cores involved. The focus will be here on processor cores, with delay as one of the most critical aging dependent parameters. An extensive (accelerated)-test program was set-up to evaluate the aging of both the health monitors as well as delay of an industrial reconfigurable processor core in harsh environments. The correlation between them will serve as the basis of real-time on-chip health-monitoring based prognostics for life-time prediction, enabling a zero down-time for safety-critical applications.
  • Keywords
    ageing; integrated circuit reliability; integrated circuit testing; multiprocessing systems; reconfigurable architectures; system-on-chip; accelerated reliability testing; aging measurements; industrial reconfigurable processor core; lifetime prediction; multi processor systems-on-chip; multiprocessor SoC; real time on-chip health-monitoring; Delays; Monitoring; Reliability; Stress; System-on-chip; Temperature measurement; Temperature sensors; Dependable MP-SoC systems prognostics; accelerated reliability testing; real-time on-chip health-monitoring; specification-based testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design & Technology of Integrated Systems In Nanoscale Era (DTIS), 2014 9th IEEE International Conference On
  • Conference_Location
    Santorini
  • Type

    conf

  • DOI
    10.1109/DTIS.2014.6850656
  • Filename
    6850656