DocumentCode
1739886
Title
A vision problem in wire bonding
Author
Noor, Norliza Mohd ; Rijal, Omar Mohd ; Bader, O.M. ; Thon, P´ng Yik
Author_Institution
Univ. Teknologi Malaysia, Kuala Lumpur, Malaysia
Volume
1
fYear
2000
fDate
2000
Firstpage
299
Abstract
A requirement for good wire bonding is the existence of intermetallics between the gold ball and bond pad. A digital image of the surface of the gold ball that was attached to the bond pad was obtained and analysed with MATLAB. The `counting method´ (CM) is proposed for determining the percentage of intermetallics formation. Four experiments were performed to investigate the reliability of CM, the effect of light-offset, and the performance of a quality assistant (QA) in his ability to visually estimate (the visual method) the intermetallics coverage. The main results indicate that the visual method is inconsistent and less accurate than the counting method. The QA performs well for high intermetallics coverage, whilst for an approximately 50% intermetallics coverage the QA tends to overestimate. Critical remarks related to modeling the digital image are presented
Keywords
image processing; lead bonding; quadrature amplitude modulation; MATLAB; bond pad; counting method; digital image; experiments; gold ball; intermetallics; intermetallics coverage; intermetallics formation; light-offset; quality assistant; reliability; vision problem; visual method; wire bonding; Aluminum; Bonding; Digital images; Etching; Gold; Histograms; Intermetallic; MATLAB; Mathematical model; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2000. Proceedings
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-6355-8
Type
conf
DOI
10.1109/TENCON.2000.893678
Filename
893678
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