Wafer level lead free solder bumping process and characterization

Author

Viswanadam, Gautham ; Han, Leow Khim

Author_Institution

Inst. of Microelectron., Singapore

fYear

2000

fDate

2000

Firstpage

7

Lastpage

11

Abstract

The paper introduces an overview of the lead free solder bumping process with a solder paste printing method. The bumping process and process variations for three different lead free solder pastes are discussed. Performance matrices include bump height, bump diameter, and shear strength variations with respect to reliability conditions such as multiple reflows, temperature cycling, temperature/humidity, pressure cooker test, and high temperature storage test, are discussed in the paper

Keywords

environmental degradation; environmental factors; humidity; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; microassembling; reflow soldering; shear strength; thermal stresses; bumping process; high temperature storage test; lead free solder bumping process; lead free solder pastes; multiple reflow conditions; performance matrices; pressure cooker test; process variations; reliability conditions; shear strength variations; solder bump diameter; solder bump height; solder paste printing method; temperature cycling test; temperature/humidity test; wafer level lead free solder bumping process; Costs; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Printing; Temperature; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on

Conference_Location

Hong Kong

Print_ISBN

0-7803-6654-9

Type

conf

DOI

10.1109/EMAP.2000.904127

Filename

904127