• DocumentCode
    1744111
  • Title

    Shape-based optimization of a plasma etching process

  • Author

    Berg, Jordan M. ; Zhou, Nan

  • Author_Institution
    Dept. of Mech. Eng., Texas Tech. Univ., Lubbock, TX, USA
  • Volume
    3
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    2023
  • Abstract
    This paper considers the problem of determining a finite number of discrete parameters appearing in a nonlinear partial differential equation describing a curve evolution process. The method is applied to the plasma etching of thin films for semiconductor manufacturing. Results are obtained within the mathematical framework of level set methods. Here, the evolution of the curve under study is captured through the evolution of a level set function. The underlying physics of the process are completely contained in a scalar function called the speed function. The degree of difficulty of treating the evolution equation depends on the functional dependencies of the speed function. This paper presents optimal estimation and design techniques based on analytical gradient computations for a class of position and orientation dependent speed functions. The technique is demonstrated on a plasma etching model taken from the literature. Only simulation results are presented here, but the model under study has been shown to reproduce experimental data with reasonable accuracy. In the estimation problem, parameters in the model are fit to best match the feature shape measured in experiments. In the optimal design problem, parameter values are selected to most closely attain a desired feature shape
  • Keywords
    integrated circuit manufacture; nonlinear differential equations; optimal control; parameter estimation; partial differential equations; process control; semiconductor device manufacture; sputter etching; thin films; analytical gradient computations; curve evolution process; discrete parameters; level set methods; nonlinear partial differential equation; optimal design problem; orientation dependent speed functions; parameter values; plasma etching; plasma etching process; position dependent speed functions; scalar function; semiconductor manufacturing; shape-based optimization; speed function; thin films; Etching; Level set; Partial differential equations; Physics; Plasma applications; Plasma materials processing; Plasma measurements; Semiconductor device manufacture; Semiconductor thin films; Shape measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Decision and Control, 2000. Proceedings of the 39th IEEE Conference on
  • Conference_Location
    Sydney, NSW
  • ISSN
    0191-2216
  • Print_ISBN
    0-7803-6638-7
  • Type

    conf

  • DOI
    10.1109/CDC.2000.914089
  • Filename
    914089