DocumentCode
1744450
Title
Research in the field of systems-in-a-package at the Interuniversity Microelectronics Center (IMEC)
Author
Mertens, R.
Author_Institution
IMEC, Leuven, Belgium
fYear
2000
fDate
2000
Firstpage
15
Lastpage
17
Abstract
Systems-in-a-package technologies are likely to be extremely important in numerous fields. After discussion of a number of visions and trends, the work at the Interuniversity Microelectronics Center (IMEC) on systems-in-a-packcage for RF, optical, infrared and biosensor applications is discussed
Keywords
biosensors; image sensors; infrared detectors; integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; microwave integrated circuits; multichip modules; optical interconnections; IMEC; Interuniversity Microelectronics Center; MCM; RF applications; biosensor applications; infrared applications; optical applications; systems-in-a-package; systems-in-a-package technologies; Biomedical optical imaging; Biosensors; Microelectromechanical devices; Microelectronics; Nonhomogeneous media; Optical interconnections; Optical sensors; Packaging; Radio frequency; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2000. ICM 2000. Proceedings of the 12th International Conference on
Conference_Location
Tehran
Print_ISBN
964-360-057-2
Type
conf
DOI
10.1109/ICM.2000.916405
Filename
916405
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