• DocumentCode
    1753931
  • Title

    Enhance transfer performance for high throughput tools by control scenario

  • Author

    Chen, Yu-Jen ; Lo, Hsi-Lo ; Pan, Cheng-Chung ; Chan, Nian-Wei

  • Author_Institution
    Rexchip Electron. Corp., Taichung, Taiwan
  • fYear
    2010
  • fDate
    18-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    With the advance of semiconductor manufacturing technology, tools Process Time (PT) will become shorter and shorter. But Automated Material Handling System (AMHS) has throughput limitation to affect tool performance. It may directly make tools while idle for waiting FOUP transportation and indirectly affects how many tools to purchase in Fab. This problem often happens as short PT tools, (i.e. PT <; Transfer Time), single load port tools, and high throughput bay line with vehicle traffic jam, etc. In this paper, we present some approaches to improve it through shortening Transfer Time. After the simulation in real Fab, these approaches have been proven to increase 6~15% of high throughput tools utilization.
  • Keywords
    factory automation; machine tools; materials handling equipment; FOUP transportation; automated material handling system; enhance transfer performance; high throughput tools; real Fab; semiconductor manufacturing technology; throughput bay line; tool performance; tool process time; transfer time; vehicle traffic jam; Metrology; AMHS; high throughput; local buffer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM), 2010 International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-0392-8
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • Filename
    5750197