• DocumentCode
    1754173
  • Title

    3D ICs and pixel sensors: The Italian VIPIX project and the European AIDA WP3 project

  • Author

    Re, V.

  • Author_Institution
    INFN, Univ. of Bergamo, Bergamo, Italy
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Presents a collection of slides covering the following topics: 3D integrated circuits; pixel sensors; Tezzaron vertical integration technology; microelectronics; and interconnection technology.
  • Keywords
    integrated circuit interconnections; three-dimensional integrated circuits; 3D integrated circuits; Tezzaron vertical integration technology; interconnection technology; microelectronics; pixel sensors; Active pixel sensors; CMOS integrated circuits; Detectors; Pixel; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751420
  • Filename
    5751420
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1754173