• DocumentCode
    1758933
  • Title

    Patents and High-Speed Datacenter Interconnects

  • Author

    Altman, Erik R.

  • Author_Institution
    IBM T.J. Watson Research Center
  • Volume
    34
  • Issue
    5
  • fYear
    2014
  • fDate
    Sept.-Oct. 2014
  • Firstpage
    4
  • Lastpage
    5
  • Abstract
    This column discusses some of the issues surrounding high-speed datacenter interconnects, including bandwidth and interconnect design. It also examines business and software patents.
  • Keywords
    CPU; GPU; I/O; NIC; cache; data center; datacenter; interconnects; network interface card; patents; simulation; topology;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2014.87
  • Filename
    6915619
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1758933