• DocumentCode
    1758974
  • Title

    Investigation on the Direct Method for the Extraction of Semiconductor Material Parameters Using the EBIC Line Scan: Planar-Collector Configuration

  • Author

    Chee Chin Tan ; Ong, Vincent K. S. ; Radhakrishnan, Krishnaja

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    60
  • Issue
    7
  • fYear
    2013
  • fDate
    41456
  • Firstpage
    2346
  • Lastpage
    2352
  • Abstract
    In this paper, a study on the electron beam induced current (EBIC) technique for the extraction of semicon-ductor parameters in the planar-collector configuration is presented. The EBIC line scan data are computed using an expression published in the Journal of Engineering Mathematics in 1984. and their correctness is verified using a 2-D device simulator. The EBIC data are then used to investigate the direct method to determine the diffusion length and surface recombination velocity proposed by another study publised in the IEEE Transaction on Electron Devices in 1995. The impacts of the starting location and the width of beam scanning range and depth of the generation volume on the linearization coefficient and the accuracy of the extracted diffusion length are presented. A new set of fitting parameters to extract the surface recombination velocity at the beam entry surface from the value is redefined, hence, improving the accuracy of the extraction. The conditions for the accurate extraction of diffusion length and surface recombination velocity are discussed.
  • Keywords
    EBIC; semiconductor device measurement; surface recombination; 2D device simulator; EBIC line scan; beam scanning range; diffusion length; electron beam induced current technique; fitting parameter; generation volume; linearization coefficient; planar-collector configuration; semiconductor material parameter; surface recombination velocity; Charge-carrier processes; electron microscopy; semiconductor device measurement; semiconductor materials;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2259170
  • Filename
    6527281