• DocumentCode
    1761061
  • Title

    MRI Heating Reduction for External Fixation Devices Using Absorption Material

  • Author

    Xin Huang ; Jianfeng Zheng ; Xin Wu ; Kono, Mari ; Hozono, Hideki ; Kainz, Wolfgang ; Fan Yang ; Ji Chen

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
  • Volume
    57
  • Issue
    4
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    635
  • Lastpage
    642
  • Abstract
    This paper presents a novel approach to minimize the radio frequency (RF)-induced heating from external fixation devices under magnetic resonance imaging (MRI) procedure. With proper placement and selection of absorption material, one can alter the electromagnetic field and current distributions around and/or on medical devices so that the MRI RF field-induced heating can be reduced. The absorption-material-based RF heating reduction schemes are analyzed and validated. Numerical and experimental studies are conducted to illustrate the potentials of reducing the RF heating for external fixation devices. A design strategy based on response surface methodology is presented for material selection, and it is shown that absorption materials can significantly reduce the RF heating effects from 645 to 172 W/kg in terms of 1-g spatial-averaged SAR for the device under this investigation.
  • Keywords
    absorbing media; biomedical MRI; biomedical equipment; current distribution; radiofrequency heating; response surface methodology; MRI RF field-induced heating; MRI heating reduction; absorption material selection; current distribution; electromagnetic field; external fixation device; magnetic resonance imaging procedure; medical device; radiofrequency induced heating; response surface methodology; spatial-averaged SAR; Absorption; Conductivity; Heating; Magnetic resonance imaging; Materials; Phantoms; Radio frequency; Absorption material; RF heating reduction; external fixation; response surface methodology (RSM);
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2015.2407318
  • Filename
    7057678