DocumentCode
1764619
Title
Impact of Sidewall Passivation and Channel Composition on Inx Ga1-x As FinFET Performance
Author
Thathachary, Arun V. ; Lavallee, Guy ; Cantoro, Mirco ; Bhuwalka, Krishna K. ; Yeon-Cheol Heo ; Maeda, Shigenobu ; Datta, Soupayan
Author_Institution
Dept. of Electr. Eng., Pennsylvania State Univ., State College, PA, USA
Volume
36
Issue
2
fYear
2015
fDate
Feb. 2015
Firstpage
117
Lastpage
119
Abstract
We experimentally demonstrate InxGa1-xAs FinFET devices with varying indium composition and quantum confinement effect. While increasing indium content enhances drive current by increasing the injection velocity, increasing quantum confinement enhances the drive currents by significantly improving the short-channel effects. Further, improved sidewall passivation using an in situ plasma nitride passivation process provides additional improved subthreshold behavior. Competitive drive currents are obtained with FinFETs realized through a scaled fin pitch process allowing 10-fins/μm layout width at a fin width of 20 nm. We report field effect mobility from multifin split-capacitance-voltage (split-CV) measurements having peak mobility of 3480 cm2/V·s for a 10-nm QW FinFET with 70% indium. Peak transconductance (gmmax) of 1.62 mS/μm, normalized to circumference, is demonstrated for devices with LG=120 nm.
Keywords
III-V semiconductors; MOSFET; field effect devices; indium compounds; passivation; FinFET devices; InGaAs; channel composition; field effect mobility; in situ plasma nitride passivation process; injection velocity; quantum confinement effect; scaled fin pitch process; short-channel effects; sidewall passivation; size 10 nm; size 20 nm; FinFETs; Indium; Logic gates; Plasmas; Potential well; Transconductance; FinFET; III-V; InGaAs; MOSFET; plasma nitride; sidewall;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2384280
Filename
6991559
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