• DocumentCode
    1764619
  • Title

    Impact of Sidewall Passivation and Channel Composition on InxGa1-xAs FinFET Performance

  • Author

    Thathachary, Arun V. ; Lavallee, Guy ; Cantoro, Mirco ; Bhuwalka, Krishna K. ; Yeon-Cheol Heo ; Maeda, Shigenobu ; Datta, Soupayan

  • Author_Institution
    Dept. of Electr. Eng., Pennsylvania State Univ., State College, PA, USA
  • Volume
    36
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    117
  • Lastpage
    119
  • Abstract
    We experimentally demonstrate InxGa1-xAs FinFET devices with varying indium composition and quantum confinement effect. While increasing indium content enhances drive current by increasing the injection velocity, increasing quantum confinement enhances the drive currents by significantly improving the short-channel effects. Further, improved sidewall passivation using an in situ plasma nitride passivation process provides additional improved subthreshold behavior. Competitive drive currents are obtained with FinFETs realized through a scaled fin pitch process allowing 10-fins/μm layout width at a fin width of 20 nm. We report field effect mobility from multifin split-capacitance-voltage (split-CV) measurements having peak mobility of 3480 cm2/V·s for a 10-nm QW FinFET with 70% indium. Peak transconductance (gmmax) of 1.62 mS/μm, normalized to circumference, is demonstrated for devices with LG=120 nm.
  • Keywords
    III-V semiconductors; MOSFET; field effect devices; indium compounds; passivation; FinFET devices; InGaAs; channel composition; field effect mobility; in situ plasma nitride passivation process; injection velocity; quantum confinement effect; scaled fin pitch process; short-channel effects; sidewall passivation; size 10 nm; size 20 nm; FinFETs; Indium; Logic gates; Plasmas; Potential well; Transconductance; FinFET; III-V; InGaAs; MOSFET; plasma nitride; sidewall;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2384280
  • Filename
    6991559