• DocumentCode
    1767065
  • Title

    Carbon nanostructures dedicated to RF interconnect management

  • Author

    Brun, C. ; Baillargeat, D. ; Chong, Y.C. ; Tan, D. ; Coquet, P. ; Tay, B.K.

  • Author_Institution
    XLIM UMR 7252, Université de Limoges/CNRS, 123 Avenue Albert Thomas, France
  • fYear
    2014
  • fDate
    6-9 Oct. 2014
  • Firstpage
    1448
  • Lastpage
    1451
  • Abstract
    Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.
  • Keywords
    Carbon nanotubes; Flip-chip devices; Integrated circuit interconnections; Integrated circuit modeling; Metals; Radio frequency; Resistance; Carbon nanotubes; Electromagnetic modeling; Flip-chip; Monopole antennas;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2014 44th European
  • Conference_Location
    Rome
  • Type

    conf

  • DOI
    10.1109/EuMC.2014.6986719
  • Filename
    6986719