DocumentCode
1767065
Title
Carbon nanostructures dedicated to RF interconnect management
Author
Brun, C. ; Baillargeat, D. ; Chong, Y.C. ; Tan, D. ; Coquet, P. ; Tay, B.K.
Author_Institution
XLIM UMR 7252, Université de Limoges/CNRS, 123 Avenue Albert Thomas, France
fYear
2014
fDate
6-9 Oct. 2014
Firstpage
1448
Lastpage
1451
Abstract
Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.
Keywords
Carbon nanotubes; Flip-chip devices; Integrated circuit interconnections; Integrated circuit modeling; Metals; Radio frequency; Resistance; Carbon nanotubes; Electromagnetic modeling; Flip-chip; Monopole antennas;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (EuMC), 2014 44th European
Conference_Location
Rome
Type
conf
DOI
10.1109/EuMC.2014.6986719
Filename
6986719
Link To Document