Orthogonal wideband (DC-10 GHz) microstrip-to-microstrip transition using flexible LCP interconnects

Author

McQuaide, Dylan ; Khan, Wasif ; Guidoni, Luca ; Ruzzene, Massimo ; Papapolymerou, John

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2014

fDate

6-9 Oct. 2014

Firstpage

1781

Lastpage

1784

Abstract

This paper presents an orthogonal, broadband microstrip-to-microstrip RF transition at the board level. The transition was achieved by bonding a single metal trace fabricated on Rogers Ultralam 3850 Liquid Crystal Polymer (LCP) substrate to microstrip lines made on RO3003 substrates. 3D FEM simulations in Ansoft HFSS and measured data show that S21 for this transition is less than 1 dB over a wide range of frequencies from DC-9.5 GHz. The insertion loss per unit length remains below 0.5 dB/cm below approximately 10 GHz.

Keywords

finite element analysis; flexible electronics; liquid crystal polymers; microstrip lines; microstrip transitions; substrates; 3D FEM simulation; Ansoft HFSS; RO3003 substrate; Rogers Ultralam 3850; flexible LCP interconnect; insertion loss; liquid crystal polymer substrate; microstrip line; orthogonal wideband microstrip-to-microstrip RF transition; Broadband communication; Connectors; Integrated circuit interconnections; Loss measurement; Microstrip; Radio frequency; Substrates; LCP; Orthogonal Interconnect; broadband interconnect;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2014 44th European

Conference_Location

Rome

Type

conf

DOI

10.1109/EuMC.2014.6986803

Filename

6986803