DocumentCode
1769212
Title
Thermal-mechanical simulation of T/R microwave module assembly process
Author
Chun Pei ; Guicui Fu ; Qing Li ; Dong Zhang
Author_Institution
Reliability & Syst. Eng. Dept., Beihang Univ., Beijing, China
fYear
2014
fDate
24-27 Aug. 2014
Firstpage
414
Lastpage
417
Abstract
T/R-modules are key elements in active phased array antennas for radar and electronic warfare applications. Though much research has been carried out on the T/R microwave module operating characteristics, there are few actual studies on its assembly process. Considering many process failures found in T/R microwave module manufacturing, the assembly process, including welding and screwing, and environment test, was simulated by Finite Element Analysis (FEA) in the paper. Different flatness models were built to assess the effect of warpage. The thermal and mechanical stress values of each assembly process were showed and the results were analyzed to determine the key factors and the improvement measures to the assembly process.
Keywords
active antenna arrays; antenna phased arrays; assembling; electronic warfare; finite element analysis; microwave antenna arrays; phased array radar; thermal stresses; welding; FEA; T-R microwave module assembly process thermal-mechanical simulation; active phased array antenna; different flatness model; electronic warfare application; environment test; finite element analysis; mechanical stress; radar application; screwing process; thermal stress; welding process; Assembly; Receivers; Stress; Substrates; Transmitters; Welding; ANSYS; T/R microwave module; assembly process; thermal-mechanical simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
Conference_Location
Zhangiiaijie
Print_ISBN
978-1-4799-7957-8
Type
conf
DOI
10.1109/PHM.2014.6988205
Filename
6988205
Link To Document