• DocumentCode
    1769616
  • Title

    3D Finite Element Schrödinger equation corrected Monte Carlo simulations of nanoscale FinFETs

  • Author

    Nagy, Daniel ; Elmessary, Muhammad A. ; Aldegunde, Manuel ; Lindberg, Jari ; Dettmer, W. ; Peric, Djordje ; Loureiro, Antonio ; Kalna, Karol

  • Author_Institution
    ESDC, Swansea Univ., Swansea, UK
  • fYear
    2014
  • fDate
    3-6 June 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A 3D Finite Element Monte Carlo simulation with 2D Schrödinger based quantum correction are employed to forecast the performance of SOI Si FinFET devices scaled to gate length of 10.7 nm. The performance of these devices are greatly affected by the exact device geometry and thus the accurate description of cross-sections is essential. We chose three cross-sections: rectangular (REC), wide- (WTRI) and narrow-triangular (NTRI), with rounded corners, in 〈100〉 and 〈110〉 channel orientations. We found that the REC FinFETs give a larger drive current per perimeter than the WTRI (8%) and NTRI (26%) ones but are outperformed by the NTRI devices when normalised by the channel area [WTRI (18%) and REC (20%)]. The sub-threshold slopes are about 71, 69 and 66 mV/dec for REC, WTRI and NTRI, respectively.
  • Keywords
    MOSFET; Monte Carlo methods; Schrodinger equation; elemental semiconductors; finite element analysis; nanoelectronics; semiconductor device models; silicon; silicon-on-insulator; 2D Schrödinger based quantum correction; 3D finite element Schrödinger equation; REC; REC FinFETs; SOI silicon FinFET devices; Si; channel orientations; corrected Monte Carlo simulations; device geometry; nanoscale FinFETs; narrow-triangular NTRI; rectangular cross-sections; size 10.7 nm; sub-threshold slopes; wide-WTRI; Equations; FinFETs; Iron; Logic gates; Mathematical model; Shape; Three-dimensional displays; FinFET; Finite Elements; Monte Carlo; Schrödinger equation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Electronics (IWCE), 2014 International Workshop on
  • Conference_Location
    Paris
  • Type

    conf

  • DOI
    10.1109/IWCE.2014.6865822
  • Filename
    6865822