• DocumentCode
    1770944
  • Title

    Correlation between BTI-induced degradations and process variations by measuring frequency of ROs

  • Author

    Yabuuchi, Michitarou ; Kishida, Ryo ; Kobayashi, Kazutoshi

  • Author_Institution
    Grad. Sch. of Sci. & Technol., Kyoto Inst. of Technol., Kyoto, Japan
  • fYear
    2014
  • fDate
    19-20 June 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We analyze the correlation between BTI (Bias Temperature Instability)-induced degradations and process variations. BTI shows a strong effect on highly scaled LSIs in the same way as the process variations. It is necessary to predict the combinational effects. We should analyze both aging-degradations and process variations of MOSFETs to explain the correlation. We measure initial frequencies and the aging-degradations of ROs (ring oscillators) of 65-nm process test circuits. The initial frequencies of ROs follow gaussian distributions. The degradations can be approximated by logarithmic function of stress time. The degradation at the “fast” condition of the variations has a higher impact on the frequency than the “slow” one. The correlation coefficient is 0.338. In this case, we can reduce the design margin for BTI-induced degradations because the degradation at the “slow” conditon on the variations is smaller than the average.
  • Keywords
    MOSFET; ageing; correlation methods; frequency measurement; integrated circuit design; integrated circuit testing; large scale integration; oscillators; semiconductor device testing; BTI-induced degradation; Gaussian distribution; LSI; RO; aging degradation; bias temperature instability; combinational effect; correlation coefficient; frequency measurement; logarithmic stress time function; process test circuit; process variation; ring oscillator; size 65 nm; Correlation; Degradation; Frequency measurement; MOSFET; Reliability; Semiconductor device measurement; BTI; process variation; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-3614-4
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2014.6867095
  • Filename
    6867095