Evaluation of partial discharge inception voltage of bonding-less gas insulation packaging for high temperature and high voltage power module

The purpose of our work is to develop a power module using gas insulation and bonding-less interconnections to avoid the reliability issues known to current packaging technology. This paper deals with the temperature dependence of partial discharge inception voltage (PDIV) of a developed module up to 300 °C. In addition, an attempt is achieved to confirm half-wave rectifying operation up to 300 °C using SiCSchottky barrier diodes (SiC-SBD). From these results, the PDs were not detected up to 1500 V and 300 °C, proving its ability to be used in high temperature applications.