DocumentCode
1777006
Title
Modelling modern processors using FEM and compact model — A comparative study
Author
Galicia, Melvin ; Zajac, Piotr ; Maj, Cezary ; Szermer, Michal ; Napieralski, Andrzej
Author_Institution
Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland
fYear
2014
fDate
19-21 June 2014
Firstpage
293
Lastpage
297
Abstract
A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEM-based simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there are also non-negligible differences when estimating thermal gradients within a chip.
Keywords
finite element analysis; integrated circuit modelling; microprocessor chips; FEM-based simulation; architectural compact model; maximal temperature prediction; modern processor modelling; thermal gradient estimation; thermal models; Analytical models; Finite element analysis; Heat sinks; Heat transfer; Program processors; Thermal analysis; finite-element method; multi-core; thermal modelling; thermal simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits & Systems (MIXDES), 2014 Proceedings of the 21st International Conference
Conference_Location
Lublin
Print_ISBN
978-83-63578-03-9
Type
conf
DOI
10.1109/MIXDES.2014.6872204
Filename
6872204
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