The influence of the mounting manner of the power LEDs on its thermal and optical parameters

Author

Gorecki, Krzysztof ; Ptak, Przemyslaw

Author_Institution

Dept. of Marine Electron., Gdynia Maritime Univ., Gdynia, Poland

fYear

2014

fDate

19-21 June 2014

Firstpage

303

Lastpage

308

Abstract

The paper refers to the investigation results concerning thermal and optical properties of power LEDs. The measuring-set to measure thermal and optical parameters of the considered semiconductor devices is described and some results of measurements of transient thermal impedance and illuminance emitted by power LEDs operating at different cooling conditions are presented. Investigations were performed both for LEDs operating solely and sets of such diodes situated on the common heat-sink.

Keywords

heat sinks; light emitting diodes; optical properties; power semiconductor diodes; semiconductor device packaging; surface mount technology; thermal properties; cooling conditions; heat sink; illuminance; mounting manner; optical parameters; optical properties; power LED; semiconductor devices; thermal parameters; thermal properties; transient thermal impedance; Current measurement; Heating; Light emitting diodes; Optical variables measurement; Power measurement; Semiconductor device measurement; Temperature measurement; measurements; optical parameters; power LEDs; thermal parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits & Systems (MIXDES), 2014 Proceedings of the 21st International Conference

Conference_Location

Lublin

Print_ISBN

978-83-63578-03-9

Type

conf

DOI

10.1109/MIXDES.2014.6872206

Filename

6872206