DocumentCode
1780068
Title
Effects of a modified interface by silver nanoparticles/SiOC:H barrier layer against space charge injection under HVDC
Author
Milliere, Laurent ; Makasheva, Kremena ; Laurent, C. ; Despax, Bernard ; Boudou, Laurent ; Teyssedre, Gilbert
Author_Institution
LAPLACE (Lab. Plasma et Conversion d´Energie), Univ. de Toulouse; UPS, Narbonne, France
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
883
Lastpage
886
Abstract
Large number of studies describes phenomena associated with space charge build-up in polymeric materials and the incited consequences when high voltage direct current is imposed. Currently, the studies are oriented towards possibilities to minimize this drawback by addition of nanometric size inclusions into the bulk of the polymer material. One alternative approach is to tailor the interface of the insulating material with deep traps in order to limit and control charges injection before their penetration into the bulk. The barrier layer is composed of a mono plan of silver nanoparticles (AgNPs) embedded in an organosilicon matrix (SiOC:H) issued from hexamethyldisiloxane plasma polymerization and deposited at the surface of a low density polyethylene (LDPE) film. We present a comparative study of charge density distribution between reference LDPE films and a one-face tailored sample. The impact of the barrier layer was evaluated for applied fields in the range 10 to 50 kV/mm. Results show a high efficiency of the AgNPs/SiOC:H barrier layer to limit injection of space charge at the LDPE interface, for both positive and negative charges.
Keywords
charge injection; dielectric thin films; filled polymers; nanocomposites; nanofabrication; nanoparticles; plasma deposition; polymer films; polymerisation; silicon compounds; silver; space charge; HVDC; LDPE; charge density distribution; deep traps; hexamethyl disiloxane plasma polymerization; high voltage direct current; insulating material interface; low density polyethylene film surface; modified interface effects; nanocomposite; nanometric size inclusions; negative charges; organosilicon matrix; polymeric materials; positive charges; silver nanoparticles-SiOC:H barrier layer; space charge injection; Electrodes; Insulation; Plasmas; Polyethylene; Space charge; plasma processes; polymeric materials; silver nanoparticles; space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995810
Filename
6995810
Link To Document