• DocumentCode
    1780243
  • Title

    Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method

  • Author

    Yanhui Huang ; Krentz, Timothy M. ; Nelson, J.K. ; Schadler, Linda S. ; Yang Li ; He Zhao ; Brinson, L. Catherine ; Bell, Michael ; Benicewicz, Brian ; Ke Wu ; Breneman, Curt M.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    748
  • Lastpage
    751
  • Abstract
    Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.
  • Keywords
    composite materials; dielectric materials; dielectric relaxation; epoxy insulation; finite element analysis; transmission electron microscopy; TEM image; bimodal brush functionalized epoxy nanodielectric; composite filler distribution; dielectric property; dielectric spectra simulation; epoxy compatible chain; finite element 2D analysis method; fitting parameters; graft density; interface dielectric relaxation behavior prediction; interface property impact; interfacial area; model geometry; modeling method; short molecule; silica; Equations; Manganese; Mathematical model; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995897
  • Filename
    6995897