DocumentCode
1780255
Title
Polyethylene/styrenic block copolymer blends: Morphology and dielectric properties
Author
Helal, Emna ; Demarquette, Nicole R. ; David, E. ; Frechette, M.F.
Author_Institution
Dept. of Mech. Eng., Ecole de Technol. Super. ETS, Montréal, QC, Canada
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
767
Lastpage
770
Abstract
In this work, a polymer blend of High Density Polyethylene HDPE and Styrene-Ethylene-Butylene-Styrene SEBS triblock copolymer has been prepared. The composition of the blend was tailored to control the morphology from a state of dispersed droplets of SEBS in a PE matrix to a fiber-like morphology. The microstructure of the blends has been assessed by means of Scanning Electron Microscopy SEM. The Thermal Gravimetric Analysis TGA has been performed on the samples to evaluate their thermal stability. The materials dielectric response was evaluated using Broadband Dielectric Spectroscopy BDS and the AC dielectric strength has been estimated by means of short-term breakdown tests. Overall, an improvement of the thermal stability of HDPE has been induced in the blend containing respectively 10 and 20 wt% of SEBS in droplets form. Moreover, the AC breakdown strength and the dielectric loss of this blend configuration remained in the same range of the pure HDPE. However, a consistent decrease of the AC dielectric strength, by approximately 13%, has been induced in the blend with a fiber-like morphology.
Keywords
dielectric losses; drops; electric breakdown; electric strength; polyethylene insulation; polymer blends; scanning electron microscopy; thermal analysis; thermal stability; AC breakdown strength; AC dielectric strength; BDS; PE matrix; SEBS; SEM; TGA; broadband dielectric spectroscopy; dielectric loss; dielectric property; droplet; high density polyethylene HDPE; materials dielectric response; morphology property; polyethylene-styrenic block copolymer blend microstructure; scanning electron microscopy; short-term breakdown test; styrene-ethylene-butylene-styrene SEBS triblock copolymer; thermal gravimetric analysis; thermal stability; Dielectric breakdown; Dielectrics; Morphology; Polyethylene; Thermal stability; blend; block copolymer; breakdown strength; dielectric permittivity; nanostructured matrix; polyethylene;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995902
Filename
6995902
Link To Document