• DocumentCode
    1785518
  • Title

    Quantitative measures for electromagnetic compatibility analysis of electronic systems

  • Author

    Mehri, Milad ; Masoumi, Nasser

  • Author_Institution
    Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
  • fYear
    2014
  • fDate
    20-22 May 2014
  • Firstpage
    306
  • Lastpage
    310
  • Abstract
    In this paper, for the first time, quantitative measures are proposed for susceptibility of electronic systems implemented on printed circuit boards. The sub-circuits of a complex system are considered at their connecting leads and traces. The threshold levels of fault occurrence are categorized for both digital and analog sub-systems. For analog circuits the Maximum worst case, THD, ripple, RMS, and power of induced voltage are chosen to be the measures for functional immunity of electronic systems against external threats. In addition, for digital circuits, induced jitter, eye-diagram closure, and Maximum worst case are chosen to be the criteria of quantization.
  • Keywords
    electromagnetic compatibility; printed circuit design; analog circuits; analog sub-systems; digital circuits; digital sub-systems; electromagnetic compatibility analysis; electronic systems; eye-diagram closure; fault occurrence; functional immunity; induced jitter; induced voltage; maximum worst case; printed circuit boards; threshold levels; Analytical models; Damping; Electromagnetic compatibility; Electromagnetic scattering; Electromagnetics; Pollution measurement; Voltage measurement; Electromagnetic Compatibility (EMC); Electromagnetic Interference (EMI); Quantitative Measures for EMI Fault;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering (ICEE), 2014 22nd Iranian Conference on
  • Conference_Location
    Tehran
  • Type

    conf

  • DOI
    10.1109/IranianCEE.2014.6999553
  • Filename
    6999553