DocumentCode
1785518
Title
Quantitative measures for electromagnetic compatibility analysis of electronic systems
Author
Mehri, Milad ; Masoumi, Nasser
Author_Institution
Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
fYear
2014
fDate
20-22 May 2014
Firstpage
306
Lastpage
310
Abstract
In this paper, for the first time, quantitative measures are proposed for susceptibility of electronic systems implemented on printed circuit boards. The sub-circuits of a complex system are considered at their connecting leads and traces. The threshold levels of fault occurrence are categorized for both digital and analog sub-systems. For analog circuits the Maximum worst case, THD, ripple, RMS, and power of induced voltage are chosen to be the measures for functional immunity of electronic systems against external threats. In addition, for digital circuits, induced jitter, eye-diagram closure, and Maximum worst case are chosen to be the criteria of quantization.
Keywords
electromagnetic compatibility; printed circuit design; analog circuits; analog sub-systems; digital circuits; digital sub-systems; electromagnetic compatibility analysis; electronic systems; eye-diagram closure; fault occurrence; functional immunity; induced jitter; induced voltage; maximum worst case; printed circuit boards; threshold levels; Analytical models; Damping; Electromagnetic compatibility; Electromagnetic scattering; Electromagnetics; Pollution measurement; Voltage measurement; Electromagnetic Compatibility (EMC); Electromagnetic Interference (EMI); Quantitative Measures for EMI Fault;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering (ICEE), 2014 22nd Iranian Conference on
Conference_Location
Tehran
Type
conf
DOI
10.1109/IranianCEE.2014.6999553
Filename
6999553
Link To Document