• DocumentCode
    1786990
  • Title

    Reinforcement learning-based inter- and intra-application thermal optimization for lifetime improvement of multicore systems

  • Author

    Das, Aruneema ; Shafik, Rishad Ahmed ; Merrett, Geoff V. ; Al-Hashimi, B.M. ; Kumar, Ajit ; Veeravalli, Bharadwaj

  • Author_Institution
    Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The thermal profile of multicore systems vary both within an application´s execution (intra) and also when the system switches from one application to another (inter). In this paper, we propose an adaptive thermal management approach to improve the lifetime reliability of multicore systems by considering both inter- and intra-application thermal variations. Fundamental to this approach is a reinforcement learning algorithm, which learns the relationship between the mapping of threads to cores, the frequency of a core and its temperature (sampled from on-board thermal sensors). Action is provided by overriding the operating system´s mapping decisions using affinity masks and dynamically changing CPU frequency using in-kernel governors. Lifetime improvement is achieved by controlling not only the peak and average temperatures but also thermal cycling, which is an emerging wear-out concern in modern systems. The proposed approach is validated experimentally using an Intel quad-core platform executing a diverse set of multimedia benchmarks. Results demonstrate that the proposed approach minimizes average temperature, peak temperature and thermal cycling, improving the mean-time-to-failure (MTTF) by an average of 2× for intra-application and 3× for inter-application scenarios when compared to existing thermal management techniques. Furthermore, the dynamic and static energy consumption are also reduced by an average 10% and 11% respectively.
  • Keywords
    electronic engineering computing; integrated circuit reliability; learning (artificial intelligence); microprocessor chips; multiprocessing systems; thermal management (packaging); CPU frequency; adaptive thermal management; affinity masks; average temperature minimization; in-kernel governor; interapplication thermal optimization; intraapplication thermal optimization; lifetime reliability; mean-time-to-failure improvement; multicore system lifetime improvement; multimedia benchmark; peak temperature minimization; reinforcement learning; thermal cycling minimization; thermal profile; Legged locomotion; Linux; Reliability; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1145/2593069.2593199
  • Filename
    6881497