DocumentCode
1787146
Title
Deformation Method Using Physical Parameters Composed of Different Tissue Structures
Author
Oliveira, Ana C. M. T. G. ; Tori, Romero ; Bernardes, Joao L. ; Torres, Rafael S. ; Brito, Wyllian ; Nunes, Fatima L. S.
Author_Institution
Polytech. Sch., Univ. of Sao Paulo, São Paulo, Brazil
fYear
2014
fDate
27-29 May 2014
Firstpage
94
Lastpage
99
Abstract
In order to achieve the realism required in simulating the physical behavior of tissues during deformation, the methods which allow the use of physical parameters are the most widely employed. This paper presents a method of simulating the deformation of three-dimensional objects that represent human organs through multiple layers of tissue, which utilizes the following physical parameters: modulus of elasticity, thickness and density. The number of layers and the allocation of physical parameters can be set according to the different tissues that make up the human body and the behavior to be simulated. Thus, it is possible to achieve visual realism, realistic haptics and real-time interaction, with acceptable computational cost. For the simulation of medical procedures, both visual realism and haptic technology are required in order to provide the user with sensations similar to those found in real procedures. The organ chosen for the experiments was the breast, and the results obtained in relation to the physical behavior of deformation were acceptable in relation to visual realism and haptics.
Keywords
biological tissues; haptic interfaces; medical computing; virtual reality; deformation method; density parameter; haptic technology; medical procedures; modulus-of-elasticity; physical parameters; thickness parameter; three-dimensional object deformation; tissue structures; visual realism; Breast; Equations; Force; Haptic interfaces; Mathematical model; Springs; Visualization; Three-dimensional interaction; deformable models; human tissue; surgery simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Based Medical Systems (CBMS), 2014 IEEE 27th International Symposium on
Conference_Location
New York, NY
Type
conf
DOI
10.1109/CBMS.2014.71
Filename
6881855
Link To Document