DocumentCode
1787697
Title
PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
Author
Sridhar, Arvind ; Sabry, Mohamed M. ; Ruch, Patrick ; Atienza, David ; Michel, Bruno
Author_Institution
Embedded Syst. Lab. (ESL), EPFL, Lausanne, Swaziland
fYear
2014
fDate
2-6 Nov. 2014
Firstpage
527
Lastpage
534
Abstract
Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multiprocessor system-on-chip (MPSoC), that generate electricity to power up the entire or part of the chip, while also simultaneously acting as a high-efficiency microfluidic heat sink. Further development of this technology requires efficient modeling tools that would assess the efficacy of such solutions and help perform early-stage design space exploration. In this paper, we propose a compact mathematical model, called PowerCool, that performs electro-chemical modeling and simulation of integrated microfluidic power generation in MPSoCs. The accuracy of the model has been validated against fine-grained multiphysics simulations of flow cells in the COMSOL software that is unsuitable for EDA because of large simulation times. PowerCool model is demonstrated to be up to 425x times faster than COMSOL simulations while incurring a worst-case error of only 5%. Furthermore, the PowerCool model has been used to study and assess the efficacy of this technology for a test MPSoC.
Keywords
integrated circuit modelling; integrated circuit packaging; microfluidics; multiprocessing systems; silicon; system-on-chip; COMSOL software; EDA; PowerCool model; Si; bright silicon MPSoC; compact mathematical model; electro-chemical modeling; fine-grained multiphysics simulation; integrated microfluidic power generation; Anodes; Cathodes; Electric potential; Equations; Mathematical model; Microchannels;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
Type
conf
DOI
10.1109/ICCAD.2014.7001401
Filename
7001401
Link To Document