• DocumentCode
    1787697
  • Title

    PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs

  • Author

    Sridhar, Arvind ; Sabry, Mohamed M. ; Ruch, Patrick ; Atienza, David ; Michel, Bruno

  • Author_Institution
    Embedded Syst. Lab. (ESL), EPFL, Lausanne, Swaziland
  • fYear
    2014
  • fDate
    2-6 Nov. 2014
  • Firstpage
    527
  • Lastpage
    534
  • Abstract
    Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multiprocessor system-on-chip (MPSoC), that generate electricity to power up the entire or part of the chip, while also simultaneously acting as a high-efficiency microfluidic heat sink. Further development of this technology requires efficient modeling tools that would assess the efficacy of such solutions and help perform early-stage design space exploration. In this paper, we propose a compact mathematical model, called PowerCool, that performs electro-chemical modeling and simulation of integrated microfluidic power generation in MPSoCs. The accuracy of the model has been validated against fine-grained multiphysics simulations of flow cells in the COMSOL software that is unsuitable for EDA because of large simulation times. PowerCool model is demonstrated to be up to 425x times faster than COMSOL simulations while incurring a worst-case error of only 5%. Furthermore, the PowerCool model has been used to study and assess the efficacy of this technology for a test MPSoC.
  • Keywords
    integrated circuit modelling; integrated circuit packaging; microfluidics; multiprocessing systems; silicon; system-on-chip; COMSOL software; EDA; PowerCool model; Si; bright silicon MPSoC; compact mathematical model; electro-chemical modeling; fine-grained multiphysics simulation; integrated microfluidic power generation; Anodes; Cathodes; Electric potential; Equations; Mathematical model; Microchannels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • DOI
    10.1109/ICCAD.2014.7001401
  • Filename
    7001401