DocumentCode
1792557
Title
Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration
Author
Ito, Yu ; Fukushima, Tetsuya ; Lee, Ki-Won ; Choki, Koji ; Tanaka, T. ; Koyanagi, Mitsumasa
Author_Institution
Grad. Sch. of Eng., Tohoku Univ., Sendai, Japan
fYear
2014
fDate
15-16 July 2014
Firstpage
15
Lastpage
15
Abstract
Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and -2.0 μm in X and Y directions.
Keywords
elemental semiconductors; hydrophilicity; hydrophobicity; integrated circuit bonding; self-assembly; silicon; surface emitting lasers; surface tension; three-dimensional integrated circuits; 3D integration; Si; VCSEL chip bonding; dummy chips; heterointegration; hydrophilic sites; hydrophobic area; liquid surface tension; silicon interposer; surface-tension driven self-assembly; vertical cavity surface emitting laser; Accuracy; Arrays; Assembly; Optical devices; Self-assembly; Surface tension; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4799-5260-1
Type
conf
DOI
10.1109/LTB-3D.2014.6886154
Filename
6886154
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