• DocumentCode
    1793631
  • Title

    Laser integration with CMOS assembly process for Si photonics

  • Author

    Tseng, Ricky ; O´Callaghan, James ; Eid, Feras ; Gleeson, Michael ; Rawlings, Brandon ; Kobrinsky, Mauro ; Ban, Ibrahim ; Nagle, Roger ; McFarlane, William ; Corbett, Brandon ; Chang, Peter

  • Author_Institution
    Components Res., Technol. Manuf. Group, Intel Ireland, Leixlip, Ireland
  • fYear
    2014
  • fDate
    9-13 March 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    High performance laser is integrated on Si substrates with evanescently coupled polymer waveguides. The design allows 2μm misalignment, consistent with CMOS assembly. 4μm gap and 8dB loss were demonstrated with improvement paths to <;2dB loss.
  • Keywords
    CMOS integrated circuits; integrated optoelectronics; optical polymers; optical waveguides; semiconductor lasers; CMOS assembly process; Si; Si substrates; evanescently coupled polymer waveguides; gap; laser integration; loss; misalignment; Bonding; Couplings; Lasers; Optical losses; Optical waveguides; Polymers; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communications Conference and Exhibition (OFC), 2014
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-5575-2994-7
  • Type

    conf

  • DOI
    10.1364/OFC.2014.Th2A.41
  • Filename
    6886722
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1793631