DocumentCode
1794790
Title
Thermal influences on IC packages during manual soldering process
Author
Fodor, Alexandra ; Jano, Rajmond ; Pitica, D.
Author_Institution
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
fYear
2014
fDate
7-11 May 2014
Firstpage
54
Lastpage
57
Abstract
The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.
Keywords
assembling; integrated circuit packaging; soldering; surface mount technology; thermal management (packaging); IC packages; SolidWorks flow simulation tool; assembling technique; direct contact; manual soldering process; soldering iron; surface-mount devices; thermal camera; thermal phenomena; Cameras; Iron; Manuals; Soldering; Solid modeling; Temperature distribution; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location
Dresden
Type
conf
DOI
10.1109/ISSE.2014.6887562
Filename
6887562
Link To Document