• DocumentCode
    1794814
  • Title

    Integration of microstrip LP and BP filters to multilayer structure based on various LTCC

  • Author

    Ruman, Kornel ; Pietrikova, Alena ; Vehec, Igor ; Rovensky, Tibor ; Galajda, Pavol

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
  • fYear
    2014
  • fDate
    7-11 May 2014
  • Firstpage
    114
  • Lastpage
    119
  • Abstract
    The aim of this paper lies in a design, simulation and integration of microstrip Band-Pass (BP) and Low-Pass (LP) filters into one multilayer package based on LTCC. In this article, we introduce five-section microstrip hairpin BP filter with a centre frequency of 7 GHz and a bandwidth of approx. 2 GHz and microstrip stepped-impedance LP filter with a cut-off frequency of 2.5 GHz. The paper presents simulated and measured results of mentioned filters´ scattering parameters (S parameters) based on two different LTCC substrates (GreenTape 9K7X as well as GreenTape 951PX). Accent of this article was to investigate the impact of interlayer vias on microstrip LP filters´ performances in the high frequency (HF) area. This paper shows a possibility of how to integrated two different types of filters in one multilayer module without mutual interference in HF area. The developed multilayer structure with integrated microstrip filters should be used as a part of I - Q (In-phase Quadrature) demodulator presented in [1].
  • Keywords
    S-parameters; UHF filters; band-pass filters; ceramic packaging; demodulators; low-pass filters; microstrip filters; microwave filters; multilayers; LTCC; frequency 2.5 GHz; frequency 7 GHz; integrated microstrip filters; interlayer vias; microstrip hairpin band-pass filters; microstrip stepped-impedance low-pass filters; multilayer package; scattering parameters; Band-pass filters; Demodulation; Matched filters; Microstrip filters; Nonhomogeneous media; Substrates; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.1109/ISSE.2014.6887575
  • Filename
    6887575