• DocumentCode
    1794860
  • Title

    Working temperatures influence over the solder joints properties

  • Author

    Plotog, I. ; Vladescu, Marian

  • Author_Institution
    Center of Technol. Electron. & Interconnection Tech. - CETTI, Politeh. Univ. of Bucharest, Bucharest, Romania
  • fYear
    2014
  • fDate
    7-11 May 2014
  • Firstpage
    231
  • Lastpage
    236
  • Abstract
    It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].
  • Keywords
    RoHS compliance; internal stresses; soldering; RoHS 2 EU directive; homologous temperature concept; mechanical stress; solder joints; soldering thermal profile; temperature 398.15 K; Cooling; Electrical resistance measurement; Lead; Soldering; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.1109/ISSE.2014.6887599
  • Filename
    6887599