DocumentCode
1794860
Title
Working temperatures influence over the solder joints properties
Author
Plotog, I. ; Vladescu, Marian
Author_Institution
Center of Technol. Electron. & Interconnection Tech. - CETTI, Politeh. Univ. of Bucharest, Bucharest, Romania
fYear
2014
fDate
7-11 May 2014
Firstpage
231
Lastpage
236
Abstract
It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].
Keywords
RoHS compliance; internal stresses; soldering; RoHS 2 EU directive; homologous temperature concept; mechanical stress; solder joints; soldering thermal profile; temperature 398.15 K; Cooling; Electrical resistance measurement; Lead; Soldering; Temperature; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location
Dresden
Type
conf
DOI
10.1109/ISSE.2014.6887599
Filename
6887599
Link To Document