• DocumentCode
    1797067
  • Title

    A 10μA on-chip electrochemical impedance spectroscopy system for wearables/implantables

  • Author

    Jingren Gu ; Huanfen Yao ; Keping Wang ; Parviz, Babak ; Otis, Brian

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • fYear
    2014
  • fDate
    10-12 Nov. 2014
  • Firstpage
    309
  • Lastpage
    312
  • Abstract
    This work proposes a new time-domain integration method to realize Electrochemical Impedance Spectroscopy (EIS). Unlike traditional EIS systems which use a quadrature sinusoid stimulus, we propose a low-frequency, low-amplitude sinusoid stimulus, which is realized through a sinusoid DAC without the need for analog filter. The error caused by harmonic generation can be suppressed through integration in detection. The response current is sensed by a switched capacitor integrator with control synchronized with sinusoid DAC. The integration output is sampled and digitized by an 8-bit SAR ADC. The (1×1.1)mm2 prototype is fabricated in a 130nm CMOS process. It consumes 10μA from a 1.2V supply.
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; digital-analogue conversion; electrochemical impedance spectroscopy; filters; harmonic generation; integrated circuit testing; prosthetics; switched capacitor networks; time-domain analysis; CMOS process; EIS system; SAR ADC; analog filter; current 10 muA; harmonic generation; implantables; on-chip electrochemical impedance spectroscopy system; quadrature sinusoid stimulus; response current; sinusoid DAC; size 1 mm; size 1.1 mm; size 130 nm; switched capacitor integrator; time-domain integration method; voltage 1.2 V; wearables; Capacitors; Electrochemical impedance spectroscopy; Harmonic analysis; Impedance; Power harmonic filters; Synchronization; Time-domain analysis; Electrochemical Impedance Spectroscopy; sinusoid DAC; time-domain integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian
  • Conference_Location
    KaoHsiung
  • Print_ISBN
    978-1-4799-4090-5
  • Type

    conf

  • DOI
    10.1109/ASSCC.2014.7008922
  • Filename
    7008922