DocumentCode
1798285
Title
Novel exposure system for FOWLP and MCM photolithopraphy process
Author
Kitamura, Kokoro ; Nakai, K. ; Matsui, H. ; Nagao, T. ; Norimitsu, Y.
Author_Institution
SCREEN Holdings Co., Ltd., Kyoto, Japan
fYear
2014
fDate
4-6 Nov. 2014
Firstpage
107
Lastpage
110
Abstract
Fan-out process is one of the major technologies within WLP(Wafer Level Package), where silicon chips are buried into the mold substrate. (Fan-Out WLP)(Fig.1, 2)[1] We have developed the exposure system applying advantage of direct imaging technology with using no-mask or reticle. The system has the capability of compensating displacement of the chips on the reconfigured substrate. We have been successful that the system was able to do alignment exposure with accuracy of equal or less than 2um at |Ave.| + 3 σ.
Keywords
multichip modules; photolithography; reticles; substrates; wafer level packaging; MCM photolithography process; alignment exposure; direct imaging technology; exposure system; fan-out WLP; fan-out process; mold substrate; no-mask; reconfigured substrate; reticle; silicon chips; wafer level package; Current measurement; Design automation; Displacement measurement; Position measurement; Resists; Semiconductor device measurement; Substrates; Compensation of chip displacement; Direct imaging; FOWLP; Fan-Out; Maskless; WLP;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location
Kyoto
Print_ISBN
978-1-4799-6194-8
Type
conf
DOI
10.1109/ICSJ.2014.7009621
Filename
7009621
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