Novel packaging technologies for FPC-based optical transceiver for high-speed optical interconnect

Author

Yagisawa, Takatoshi ; Sugawara, Mariko ; Shiraishi, Tomohiro ; Tanaka, Kiyoshi

Author_Institution

Fujitsu Labs. Ltd., Kawasaki, Japan

fYear

2014

fDate

4-6 Nov. 2014

Firstpage

134

Lastpage

137

Abstract

We propose a high-speed FPC connector, an inductive peaking line on a module substrate, and an integrated lens using inkjet technology for a small-diameter photodiode to extend the frequency bandwidth on electrical and optical packaging. These techniques enable high-speed operation over 25 Gb/s. We fabricated a 4-channel flexible printed circuit-based optical engine by adopting these technologies and demonstrated a clear eye opening and error-free operation up to 41.25 Gb/s.

Keywords

electronics packaging; flexible electronics; ink jet printing; integrated optoelectronics; lenses; optical interconnections; optical transceivers; photodiodes; printed circuit interconnections; FPC connector; electrical packaging; flexible printed circuit; frequency bandwidth; inductive peaking line; inkjet technology; integrated lens; module substrate; optical engine; optical interconnect; optical packaging; optical transceiver; packaging technologies; photodiode; Adaptive optics; Bandwidth; Connectors; High-speed optical techniques; Lenses; Optical device fabrication; Optical interconnections; FPC; connector; integrated lens; optical engine; optical interconnect; photodiode; transceiver;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2014 IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4799-6194-8

Type

conf

DOI

10.1109/ICSJ.2014.7009628

Filename

7009628