Tensile testing of MEMS materials

Author

Tsuchiya, Toshiyuki

Author_Institution

Dept. of Micro Eng., Kyoto Univ., Japan

Volume

2

fYear

2005

fDate

5-9 June 2005

Firstpage

1953

Abstract

This paper describes tensile testing of thin films, such as single crystal silicon, polysilicon, silicon dioxide, silicon nitride, and metals. These films are used as mechanical structures in MEMS devices, which are strongly requested to evaluate their reliability before they become products. Thin film tensile tester equipped with an electrostatic grip system has been developed in order to test specimen that has same dimensions and was fabricated by the same process as those of application devices. Various properties have been revealed using the tester, such as fracture origin investigated from the statistical analysis, fracture mechanism from the environmental effect on strength, and strength of nanometer thick films.

Keywords

micromechanical devices; reliability; statistical analysis; tensile strength; tensile testing; thin films; MEMS devices; electrostatic grip system; environmental effect; fracture mechanism; mechanical structures; metals; micromaterial characterization; nanometer thick films; polysilicon thin films; reliability; silicon dioxide thin films; silicon nitride thin films; single crystal silicon thin films; statistical analysis; tensile testing; Crystalline materials; Electrostatics; Materials testing; Mechanical factors; Microelectromechanical devices; Micromechanical devices; Semiconductor thin films; Silicon compounds; System testing; Thin film devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on

Print_ISBN

0-7803-8994-8

Type

conf

DOI

10.1109/SENSOR.2005.1497482

Filename

1497482