• DocumentCode
    1805553
  • Title

    Work in progress — Recruiting initiatives for Hispanic, first-generation students

  • Author

    Martinez, Denise ; Jacks, Jason ; Jones, Dennis ; Faulkner, Brenda ; Bell, Peter

  • fYear
    2010
  • fDate
    27-30 Oct. 2010
  • Abstract
    The “Program to Increase College Opportunities and Successes” (PICOS) is an NSF S-STEM funded initiative to increase the number of Hispanic, first-generation, economically disadvantaged students in Math, Chemistry, Engineering, and Engineering Technology using scholarship funds and academic success initiatives. The first phase of the project was implementing a recruiting strategy. To facilitate this, a recruiting advisory board composed of Hispanic representatives from the community and university was established. This board helped develop recruiting materials, educate the management team on Hispanic family dynamics, and advertise the program in the community. A second component was to have a knowledgeable recruiter involved in the program. The recruiter also served as liaison between the PICOS program and the broader university recruiters. A third component was to alleviate anxieties about college preparedness and transition by incorporating a summer bridge program. In the first two years, 25 students were recruited into the target majors, nearly doubling the overall Hispanic enrollment in these majors. This paper will elaborate on the recruiting strategies and impacts associated with this phase of the PICOS program.
  • Keywords
    chemistry; engineering education; mathematics; recruitment; Hispanic students; Program to Increase College Opportunities and Successes; economically disadvantaged students; engineering technology; first generation students; recruiting initiatives; Bridges; Chemistry; Communities; Educational institutions; Engineering profession; Scholarships; First-generation; Hispanic; Recruiting; STEM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference (FIE), 2010 IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0190-5848
  • Print_ISBN
    978-1-4244-6261-2
  • Electronic_ISBN
    0190-5848
  • Type

    conf

  • DOI
    10.1109/FIE.2010.5673243
  • Filename
    5673243