DocumentCode
1819704
Title
A BIRA algorithm for embedded memories with 2D redundancy
Author
Lu, Shyue-Kung ; Tsai, Yu-Cheng ; Huang, Shih-Chang
Author_Institution
Dep. of Electron. Eng., Fu Jen Catholic Univ., Taipei, Taiwan
fYear
2005
fDate
5-5 Aug. 2005
Firstpage
121
Lastpage
126
Abstract
One technique to increase the yield of memories is to incorporate spare rows and/or columns into the main memory array. However, due to the long bit-line and word-line lengths in today´s SOC technology, it is not efficient to replace faulty cells with a spare row or a spare column. Therefore, the redundant rows (columns) are divided into row (column) blocks, respectively. The reconfiguration is performed at the row (column) block level instead of the conventional row (column) level. We first propose a redundancy analysis algorithm suitable for built-in implementation or embedded memories with 2D redundancy - the extended local repair-most (ELRM) algorithm. Due to the efficient utilization of redundant rows/columns, the manufacturing yield and reliability can be improved significantly. Thereafter, a simulator is implemented with C language for evaluating the repair rates of the proposed algorithm. Simulation results show the proposed approach can increase the repair rate and fabrication yield significantly.
Keywords
built-in self test; embedded systems; integrated circuit reliability; integrated circuit yield; integrated memory circuits; redundancy; 2D redundancy; BIRA algorithm; C language; built-in redundancy analysis algorithm; circuit simulator; embedded memories; extended local repair-most algorithm; manufacturing yield; reliability improvement; repair rate; Algorithm design and analysis; Circuit faults; Circuit simulation; Fabrication; Hardware; Integrated circuit reliability; Manufacturing; Random access memory; Redundancy; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Technology, Design, and Testing, 2005. MTDT 2005. 2005 IEEE International Workshop on
Conference_Location
Taipei
ISSN
1087-4852
Print_ISBN
0-7695-2313-7
Type
conf
DOI
10.1109/MTDT.2005.6
Filename
1498214
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