• DocumentCode
    1819704
  • Title

    A BIRA algorithm for embedded memories with 2D redundancy

  • Author

    Lu, Shyue-Kung ; Tsai, Yu-Cheng ; Huang, Shih-Chang

  • Author_Institution
    Dep. of Electron. Eng., Fu Jen Catholic Univ., Taipei, Taiwan
  • fYear
    2005
  • fDate
    5-5 Aug. 2005
  • Firstpage
    121
  • Lastpage
    126
  • Abstract
    One technique to increase the yield of memories is to incorporate spare rows and/or columns into the main memory array. However, due to the long bit-line and word-line lengths in today´s SOC technology, it is not efficient to replace faulty cells with a spare row or a spare column. Therefore, the redundant rows (columns) are divided into row (column) blocks, respectively. The reconfiguration is performed at the row (column) block level instead of the conventional row (column) level. We first propose a redundancy analysis algorithm suitable for built-in implementation or embedded memories with 2D redundancy - the extended local repair-most (ELRM) algorithm. Due to the efficient utilization of redundant rows/columns, the manufacturing yield and reliability can be improved significantly. Thereafter, a simulator is implemented with C language for evaluating the repair rates of the proposed algorithm. Simulation results show the proposed approach can increase the repair rate and fabrication yield significantly.
  • Keywords
    built-in self test; embedded systems; integrated circuit reliability; integrated circuit yield; integrated memory circuits; redundancy; 2D redundancy; BIRA algorithm; C language; built-in redundancy analysis algorithm; circuit simulator; embedded memories; extended local repair-most algorithm; manufacturing yield; reliability improvement; repair rate; Algorithm design and analysis; Circuit faults; Circuit simulation; Fabrication; Hardware; Integrated circuit reliability; Manufacturing; Random access memory; Redundancy; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Technology, Design, and Testing, 2005. MTDT 2005. 2005 IEEE International Workshop on
  • Conference_Location
    Taipei
  • ISSN
    1087-4852
  • Print_ISBN
    0-7695-2313-7
  • Type

    conf

  • DOI
    10.1109/MTDT.2005.6
  • Filename
    1498214