• DocumentCode
    1820100
  • Title

    Simulation on interface mechanical stress in porcelain insulators for transmission line by cement growth using ANSYS/NASTRAN program

  • Author

    Han, S.W. ; Cho, H.G. ; Woo, B.C. ; Han, D.H. ; Lee, D.I. ; Choi, I.H. ; Shin, T.W.

  • Author_Institution
    Adv. Electr. Mater. group, KERI, xx, South Korea
  • Volume
    1
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    411
  • Abstract
    The main ageing cause of many porcelain suspension insulators for transmission and distribution line with dead-end stings is a mechanical stress in interface between porcelain and cement materials. It was known that the principal mechanical stresses which give electrical failure is the results of the displacement from cement growth. We studied the effect of cement displacement resulting environmental ageing parameters on porcelain insulator mechanical properties used by analytical simulation program (ANSYS/NASTRAN) and test methods. For alumina porcelain samples, an expansion above 0.2% at 5,000 kg load is predicted to cause fracture. These simulation methods using ANSYS/NASTRAN program is very correct to experiment results. These simulation analysis and experimental results show that cement volume growth affects severely to be mechanical failure ageing.
  • Keywords
    ageing; alumina; cements (building materials); internal stresses; porcelain; porcelain insulators; power transmission lines; Al2O3; ageing; alumina porcelain; cement growth; distribution line; electrical failure; interface mechanical stress; mechanical failure ageing; mechanical properties; porcelain suspension insulators; simulation program; transmission line; Aging; Analytical models; Building materials; Failure analysis; Insulation; Insulator testing; Mechanical factors; Porcelain; Stress; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218438
  • Filename
    1218438