DocumentCode
1821858
Title
Performance assessment of technology transfer project: An application of DEA technique
Author
Punnakitikashem, P. ; Intarakumnerd, P. ; Laosirihongthong, T.
Author_Institution
Coll. of Manage., Mahidol Univ., Bangkok, Thailand
fYear
2010
fDate
7-10 Dec. 2010
Firstpage
1027
Lastpage
1031
Abstract
Technology transfer is a mechanism to acquire technology and helps company to enhance their technology capabilities. The purpose of this study is to demonstrate how Data Envelopment Analysis (DEA) can be used to assess performance of technology transfer project at firm level. Data collected from transferring the robotics operating technology project of 12 automotive parts/components manufacturing companies are examined by using the DEA model. The results of this study show that six companies carried out efficient technology transferring. The average efficiency score of technology transfer project is 93.3%. This finding confirms that absorptive capacity of recipient firms is a critical success factor underlying differences between efficient and inefficient firms. DEA method provides Chief Technology Officers (CTO) or project leaders a framework to determine appropriate transferring mechanisms and necessary internal and external resources.
Keywords
automobile manufacture; automotive components; data envelopment analysis; industrial robots; project management; technology management; automotive parts components manufacturing company; chief technology officers; data envelopment analysis; performance assessment; project leaders; robotics operating technology project; technology transfer project; Companies; Data models; Investments; Robots; Technology transfer; Training; Vehicles; DEA; chief technology officer; data envelopment analysis; performance measurement; technology transfer;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
Conference_Location
Macao
ISSN
2157-3611
Print_ISBN
978-1-4244-8501-7
Electronic_ISBN
2157-3611
Type
conf
DOI
10.1109/IEEM.2010.5674233
Filename
5674233
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