• DocumentCode
    1823335
  • Title

    Multi-domain simulation and measurement of power LED-s and power LED assemblies

  • Author

    Poppe, András ; Farkas, Gáor ; Székely, Vladimír ; Horváth, Gyögy ; Rencz, Márta

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
  • fYear
    2006
  • fDate
    14-16 March 2006
  • Firstpage
    191
  • Lastpage
    198
  • Abstract
    Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management plays important role in case of power LEDs, necessitating tools both for physical measurements and simulation. The focus of this paper is a combined electrical, thermal and optical characterization of such devices. In terms of simulation a novel approach of board-level electro-thermal simulation is presented whereas in terms of measurement, a combined thermal and radiometric characterization method is discussed
  • Keywords
    light emitting diodes; semiconductor device packaging; thermal management (packaging); board-level electro-thermal simulation; junction temperature; power LED assemblies; radiometric characterization; thermal characterization; thermal management; Assembly; Boundary conditions; Light emitting diodes; Optical devices; Power measurement; Radiometry; Semiconductor device packaging; Stimulated emission; Temperature dependence; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
  • Conference_Location
    Dallas, TX
  • Print_ISBN
    1-4244-0153-4
  • Type

    conf

  • DOI
    10.1109/STHERM.2006.1625227
  • Filename
    1625227