DocumentCode
1823335
Title
Multi-domain simulation and measurement of power LED-s and power LED assemblies
Author
Poppe, András ; Farkas, Gáor ; Székely, Vladimír ; Horváth, Gyögy ; Rencz, Márta
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
fYear
2006
fDate
14-16 March 2006
Firstpage
191
Lastpage
198
Abstract
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management plays important role in case of power LEDs, necessitating tools both for physical measurements and simulation. The focus of this paper is a combined electrical, thermal and optical characterization of such devices. In terms of simulation a novel approach of board-level electro-thermal simulation is presented whereas in terms of measurement, a combined thermal and radiometric characterization method is discussed
Keywords
light emitting diodes; semiconductor device packaging; thermal management (packaging); board-level electro-thermal simulation; junction temperature; power LED assemblies; radiometric characterization; thermal characterization; thermal management; Assembly; Boundary conditions; Light emitting diodes; Optical devices; Power measurement; Radiometry; Semiconductor device packaging; Stimulated emission; Temperature dependence; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location
Dallas, TX
Print_ISBN
1-4244-0153-4
Type
conf
DOI
10.1109/STHERM.2006.1625227
Filename
1625227
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