• DocumentCode
    1823622
  • Title

    [Back cover]

  • fYear
    2006
  • fDate
    14-16 March 2006
  • Firstpage
    241
  • Lastpage
    241
  • Abstract
    Presents the back cover of the proceedings.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
  • Conference_Location
    Dallas, TX
  • Print_ISBN
    1-4244-0153-4
  • Type

    conf

  • DOI
    10.1109/STHERM.2006.1625237
  • Filename
    1625237
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1823622