DocumentCode
1824653
Title
Study of system ESD codesign of a realistic mobile board
Author
Johnsson, David ; Gossner, Harald
Author_Institution
Intel Mobile Commun. GmbH, Neubiberg, Germany
fYear
2011
fDate
11-16 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
Based on a mobile reference board a full system ESD IC/board codesign flow was examined. Accurate high current transient models of the components and extracted board parasitics were used to simulate the effect of voltage overshoots during the first peak of the IEC 61000-4-2 pulse.
Keywords
IEC standards; electrostatic discharge; integrated circuit design; printed circuit design; transient analysis; IEC 61000-4-2 pulse; PCB design; board codesign flow; full system ESD IC codesign; high current transient models; realistic mobile board; Current measurement; Electrostatic discharge; Integrated circuit modeling; Mobile communication; Robustness; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location
Anaheim, CA
ISSN
Pending
Electronic_ISBN
Pending
Type
conf
Filename
6045613
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