DocumentCode
1825071
Title
Experimental 20 Gbit/s modules for optical fiber links
Author
Hanke, G.
Author_Institution
Deutsche Telekom AG, Darmstadt, Germany
Volume
1
fYear
1997
fDate
8-13 June 1997
Firstpage
233
Abstract
For an experimental optical fiber transmission system working at 20 Gbit/s electronic transmitter and receiver modules were developed. To guarantee reliable and error free operation, unpackaged GaAs- and Si-chips on ceramic thin film substrates in combination with a sophisticated interconnection technique had to be used.
Keywords
digital communication; hybrid integrated circuits; modules; optical fibre communication; optical receivers; optical transmitters; thin film circuits; 20 Gbit/s; 20 Gbit/s modules; GaAs; Si; ceramic thin film substrates; error free operation; interconnection technique; optical fiber links; receiver module; transmitter module; unpackaged GaAs chips; unpackaged Si chips; Circuits; Clocks; Microwave technology; Optical fibers; Optical modulation; Optical receivers; Optical signal processing; Optical transmitters; Signal processing; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.604563
Filename
604563
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