• DocumentCode
    1825203
  • Title

    Proposal of all solid insulated substation for future substation

  • Author

    Okamoto, Tatsuaki ; Shibuya, Megumi ; Takahashi, Tatsuro ; Mizutani, Y. ; Takahashi, Tatsuro

  • Author_Institution
    Central Res. Inst. of Electr. Power Ind., Yokosuka, Japan
  • Volume
    3
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    1190
  • Abstract
    This paper introduces concepts of the all solid insulated substation, which features environmental benignity, compactness, reduction of construction cost, being free from maintenance work, and so on. In the actualization of the all solid insulated substation, many problems have to be conquered, such as the development of the solid insulating materials with high heat conductivity and reasonable electrical insulating performance for a solid insulated transformer, a solid insulated compact connection system between power equipment, nondestructive diagnostic technique for the solid insulating materials, semiconductor switching devices for mechanics less power equipment, etc. This paper also depicts some part of our investigation.
  • Keywords
    epoxy insulation; heat conduction; nondestructive testing; substation insulation; switching substations; transformer insulation; transformer substations; compactness; electrical insulating performance; environmental benignity; heat conductivity; nondestructive diagnostic technique; power equipment; semiconductor switching devices; solid insulated compact connection system; solid insulated substation; solid insulated transformer; solid insulating materials; Conducting materials; Conductivity; Costs; Dielectrics and electrical insulation; Power semiconductor switches; Power transformer insulation; Proposals; Semiconductor materials; Solids; Substations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218637
  • Filename
    1218637