Design optimization and performance verification of multi-channel high-speed optical transceiver package

This article presents optic-electronic system on package, focus on signal integrity design optimization, and analysis method and performance verification of multi-channel two- way high-speed transceiver. Firstly the whole channel link performance is designed against all variables of interest. These variables are used to evaluate the solution at the system level. Signal integrity analysis and optimization of the high-density differential signal pairs on PCB is conducted to optimize impedance and minimize the effects of discontinuity in the electrical channels such as capacitor, via, connector. Power noise are measured when 2³¹-1 PRBS bit pattern is used and spectrum. A transceiver contain Tx and Rx two parts, they use one power supply node, to suppress noise and crosstalk, target impedance with/without embedded 3M C-ply and is analyzed and measured, also how different thickness top dielectric and power split impact target impedance is simulated. 3M C-ply the film capacitor measures 14 m in thickness with a dielectric constant of 16 and capacitance density of lnF/cm2. Two different differential traces are compared to demonstrate the design optimization. TDR, VNA, oscilloscope, and test structure are used to evaluate and help optimize the design.