Processing and characterization of flexographic printed conductive grid

Author

Keng, Lok Boon ; Lai, Wai Lai ; Lu, C.W.A. ; Salam, Budiman

Author_Institution

Large Area Process. Programme, Singapore Inst. of Manuf. Technol. (SIMTech), Singapore, Singapore

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

517

Lastpage

520

Abstract

In this paper, the conductive grids were flexographic printed with solvent based conductive ink. Elastomeric plate with 45° grid of 30μm line and pitch of 0.4mm was prepared. Surface resistance and optical transmittance of the printed film were characterized by two-electrode method and UV-VIS-NIR spectrophotometer respectively. At a comparable transmission level (83% measured at 600nm, without substrate), the sheet resistance obtained (11 ohm/square) by printed grid was about 50% lower than that of high conductivity ITO film (24 ohm/square).

Keywords

flexible electronics; indium compounds; ink; printed circuit manufacture; spectrophotometers; tin compounds; InSnO; UV-VIS-NIR spectrophotometer; conductive grids; elastomeric plate; flexographic printed conductive grid; high conductivity film; optical transmittance; printed film; sheet resistance; size 0.4 mm; size 30 mum; size 600 nm; solvent based conductive ink; surface resistance; two-electrode method; Films; Force; Ink; Positron emission tomography; Printing; Resistance; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184475

Filename

6184475