Yield and productivity improvements through use of advanced dual plasma source for TSV reveal & wafer dicing applications

In summary, it is clear that the deep Si etch requirements for MEMS, through- silicon vias (TSV) , via reveal and dicing have significant common ground and the experience established in any of the fields becomes useful across the others. The Pegasus Rapier has provided many of the benefits needed by users of this technology, with their inception being generated by the relative needs of their complementary markets.